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TO8 Header Encapsulated Components Transistor Outline Package

    Buy cheap TO8 Header Encapsulated Components Transistor Outline Package from wholesalers
     
    Buy cheap TO8 Header Encapsulated Components Transistor Outline Package from wholesalers
    • Buy cheap TO8 Header Encapsulated Components Transistor Outline Package from wholesalers
    • Buy cheap TO8 Header Encapsulated Components Transistor Outline Package from wholesalers
    • Buy cheap TO8 Header Encapsulated Components Transistor Outline Package from wholesalers
    • Buy cheap TO8 Header Encapsulated Components Transistor Outline Package from wholesalers

    TO8 Header Encapsulated Components Transistor Outline Package

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    Brand Name : JOPTEC
    Payment Terms : T/T
    Supply Ability : 5000000 PCS/Month
    Delivery Time : 30 Days
    • Product Details
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    TO8 Header Encapsulated Components Transistor Outline Package

    Product name:Sealed enclosure alloy package for circuit
    Finish:Fully plating Au or selective plating Au.
    Plating coating:Plate and lead plating Ni:4-11.43um,plating Au:1.0-1.3um. Cap plating Ni:4-11.43um.
    Product formation:MaterialQuantity
    1. Cap10#Steel1
    2. Welding ringHLAgCu281
    3. Lead 14J29(Kovar)1
    4. Glass insulatorBH-G/K3
    5. Lead 24J29(Kovar)3
    6. Bottom floor4J29(Kovar)1
    Insulation resistance500V DC resistance between single glass sealed pin and shell is ≥1*1010Ω
    HermeticityLeak rate is ≤1*10-3Pa.cm3/s
    Product features:1. Shell adopt material:FeNiCo,FeNi42 or CRS;
    2. The shape of pin is cyclinder and straight,material adopts Kovar.
    3. The sealing cap method is percussion welding or tin welding.

    4. The rank of pin which cross the bottom of base could be choosen

    by customers.

    5. The position of ground pin can be choosen by customer.
    6. The design of caps need to fit the shell.
    7. Customer could choose shell fully plating or pin selective plating.
    Quality TO8 Header Encapsulated Components Transistor Outline Package for sale
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